BEWARE: In the description that follows the alignment system is not included, and therefore the alignment modules are not counted in any of the totals.

The geometry

- The inner barrel has four layers, equipped with thin detectors, the outer barrel has 6 layers, equipped with thick detectors.
- In the inner barrel, detectors are titled to compensate for the Lorentz drift. An angle of 9 degrees is assumed. No compensation is made in the outer barrel.
- The forward is made of 9 big disks, the inner endcap is made of 3 small disks that closes the inner barrel.
- Big disks are made of 7 rings. The 3 outermost are equipped with thick detectors, the 4 innermost with thin detectors.
- Small disks are made of 3 rings equipped with thin detectors, identical to those of the inner 3 rings of big disks.
- The outer barrel is built with the rod mechanics. Each layer is made of two rods in z, each rod contains 6 detectors.
- The inner barrel is built with the shell mechanics, and is cut in two at z=0. Each half contains 6 detectors in z.
- The forward is built with the sector mechanics proposed by R. Siedling.
- The 2 innermost layers of the inner barrel are double sided, the 2 outermost single sided.
- Layer 1 and 2 of the outer barrel are double sided, the others single sided.
- Rings 1, 2 ad 5 in the forward are double sided, the others single sided.
- In double modules, detectors which provide the stereo coordinate are titled by an angle of 100 mrad with respect to the detectors that give the phi coordinate.
- Disks 4-9 have the mechanical structure extending down to ring 2 included, even if ring 2 (or rings 2 an 3) is not equipped with detectors. In this way there are only two types of big disk mechanics (with or without the first ring). - All detectors of the tracker are made out of 6" wafers.

Detector specifications, detector and chip multiplicities.

Inner barrel.
- Each detector is made out of one 6'' wafer. Dimensions are (approximately) 61x117 mm². The number of APVs per detector is given in Table 1, together with the phi multiplicities. Radii are approximate numbers.

Table 1: Detector multiplicity for the inner barrel

Layer #	Avg. radius	Modules in phi	Total # of modules	APV / det	Pitch phi	Pitch stereo	Total # of APVs
TIB1	255	26-30	336	6 + 6	80	80	4032
TIB2	340	34-38	432	6 + 6	80	80	5184
TIB3	430	44-46	540	4	120	-	2160
TIB4	520	52-56	648	4	120	-	2592

The TIB is made of 1188 single modules and 768 double modules, for a total of 2724 detectors, 2724 6'' wafers, and 13968 APVs.

Outer barrel.
- Each module is made out of two 6'' wafers. The dimensions of the active area are (approximately) 94x186 mm² (see Dimensions of the outer barrel detectors). The r-phi detectors have 4 or 6 APVs, for a pitch of 183 or 122 microns. The stereo detectors have 4 APVs, for a pitch of 183 microns.

Table 2: Detector multiplicity for the outer barrel

Layer #	Avg. radius	Modules in phi	Total # of modules	APV / det	Pitch phi	Pitch stereo	Total # of APVs
TOB1	608	42	504	4 + 4	183	183	4032
TOB2	692	48	576	4 + 4	183	183	4608
TOB3	780	54	648	4	183	-	2592
TOB4	868	60	720	4	183	-	2880
TOB5	965	66	792	6	122	-	4752
TOB6	1080	74	888	6	122	-	5328

The TOB is made of 3048 single modules and 1080 double modules, for a total of 5208 detectors, 10416 6'' wafers, and 24192 APVs.

Inner disks
- Detectors were optimized for 6'' wafers.
- Detectors are made out of one 6'' thin wafer.
- It is assumed that detectors in the inner disks are identical to detectors in the endcap disks. All details can be found in Study of a layout for the forward, with the new mechanics (see w6.result).
- The sizes are reported in Table 3, together with the n of chips per detector and the pitch, at the beginning and the end of the wedge.
- Detector and chip multiplicities are also reported in Table 3.

Table 3: Detector multiplicity for the inner disks.

Ring #	Modules in phi	N of rings in z	Total # of modules	APV / det	P1/P2 phi	P1/P2 stereo	Total # of APVs
TID1	24	6	144	6 + 6	81/112	81/112	1728
TID2	24	6	144	6 + 6	113/143	113/143	1728
TID3	40	6	240	4	123/158	-	960

The TID is made of 240 thin single modules and 288 thin double modules, for a total of 816 thin detectors, and 816 thin 6'' wafers. The total number of APVs is 4416.

Endcap.
- Detectors are made out of one 6'' thin wafer for rings 1-4 and out of two 6'' thick wafers for rings 5-7.
- All details can be found in Study of a layout for the forward, with the new mechanics (see w6.result).
- The sizes are reported in Table 4, together with the n of chips per detector and the pitch, at the beginning and the end of the wedge.
- Detector and chip multiplicities are also reported in Table 4.

Table 4: Detector multiplicity for the endcap.

Ring #	Modules in phi	N of rings in z	Total # of modules	APV / det	P1/P2 phi	P1/P2 stereo	Total # of APVs
TEC1	24	6	144	6 + 6	81/112	81/112	1728
TEC2	24	12	288	6 + 6	113/143	113/143	3456
TEC3	40	16	640	4	123/158	-	2560
TEC4	56	18	1008	4	113/139	-	4032
TEC5	40	18	720	6 + 6	126/156	126/156	8640
TEC6	56	18	1008	4	163/205	-	4032
TEC7	80	18	1440	4	140/172	-	5760

The TEC is made of 1648 thin single modules and 432 thin double modules, for a total of 2512 thin detectors, and 2512 thin 6'' wafers; 2448 thick single modules and 720 thick double modules, for a total of 3888 thick detectors and 7776 thick 6'' wafers. The total number of APVs is 30208.

Points and material